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Widest bandwidth RF transceiver speeds development of base stations and phased array radar

2018-6-12    Editor:Edith

Analog Devices (ADI) has expanded its RadioVerse technology and design ecosystem with the addition of the industry’s widest bandwidth RF transceiver.

transceiver


The addition of this transceiver will provide designers with a single radio platform to accelerate the deployment of 5G, sustain 2G/3G/4G coverage, and simplify phased array radar design.


The ADRV9009 RF transceiver has been designed to deliver twice the bandwidth (200 MHz) of previous generation devices and replaces as many as 20 components, cutting power in half and package size by 60 percent. With its reduced size, weight and power, the ADRV9009 transceiver meets the rigorous antenna density and expanded network capacity requirements of emerging 5G wireless infrastructure equipment and aerospace and defence systems.


The ADRV9009 is the first RF transceiver to support all existing cellular standards. It is tunable over a range of 75MHz to 6GHz to support 2G/3G/4G/5G services, which allows cellular equipment manufacturers to adopt a single, compact radio design across all band and power variants. This reduces product design times by as much as half while simplifying the deployment and maintenance of multi-band, multi-standard communications equipment.


Because of its wide bandwidth, low power and small form factor, the ADRV9009 allows designers to meet the escalating radio-channel-count requirements of 5G massive MIMO equipment. The RF transceiver is a single-chip TDD solution that can also be used in the design of portable, laboratory grade 5G test and measurement devices which are required for field testing of cellular and Internet of Things networks.


The new RF transceiver platform also features fast frequency hopping for enhanced link security and spectrum efficiency.


For both advanced cellular and phased array radar systems, the ADRV9009 simplifies digital beamforming design by handling local oscillator (LO) synchronization on-chip, eliminating the need for external LOs.

Source from:newelectronics